Congratulations to the PACK Team from Rich Township High School for their outstanding performance at the prestigious PACK EXPO held at McCormick Place in Chicago! The team’s innovative approach and exceptional marketing and sales strategies earned them a well-deserved $2,500 prize, placing them among the top six finalists in the competition.
The PACK EXPO challenged students to tackle a real-world engineering problem: enhancing the production efficiency of denesting and orienting paper coffee cups. The PACK Team rose to the occasion, demonstrating not only their technical ingenuity but also their business acumen by presenting their designs to a panel of judges acting as potential customers.
The success of the PACK Team has caught the attention of multiple organizations, several of which are eager to hire our talented students. This opens doors for valuable career opportunities, underscoring the practical, hands-on education provided at Rich Township High School. Additionally, many companies have expressed interest in future collaborations, seeking to work with our students to develop real-world equipment solutions.
We extend our deepest congratulations to the PACK Team for their dedication and hard work over the past two years. Under the guidance of instructors Mike Wilson, Adam Ekhoff, and Ontisar Freelain, these students have demonstrated perseverance, innovation, and professionalism.
Their remarkable achievement at the PACK EXPO is a testament to the district’s commitment to fostering career readiness and real-world problem-solving skills.
Please join us in celebrating the success of the PACK Team as they continue to represent Rich Township High School with excellence and pride.